The metallization of tunnel oxide and passivated contact (TOPCon) solar cells requires low contact resistances while avoiding an increased contact recombination. Laser ablation and electroplating metal deposition of an Ni/Cu metal stack bears the potential to fulfill these requirements while reducing the material costs compared to screen-printing by replacing costly silver pastes with plated Cu. In this thesis, an industrially feasible electroplating process sequence is developed to metallize bifacial TOPCon solar cells. Therefore, a simulation model is developed to gain fundamental understanding about electrical characteristics during bifacial plating of bifacial c-Si solar cells. A specific contact unit is designed to electrically contact the TOPCon solar cells. The optimized plating sequence demonstrates a certified conversion efficiency of 23.84% measured at Fraunhofer ISE CalLab for industrial bifacial TOPCon solar cells outperforming the screen-printed references by nearly 0.4%abs.