In this thesis new concepts for the metallization of temperature sensitive cell concepts are investigated. The first part deals with inks and pastes formulated from silver nanoparticles for metallization of ITO. Influences on the particle sintering process are investigated in detail. It is shown that organic additives and the capping agent for particle stabilization have a critical influence on the sintering process. A new combined sintering process of chemical and thermal sintering reaches line resistivities down to p =2.30 * 10 hoch -8 m. The behavior of the ITO surface against liquids is investigated. Direct plating on a metal seed layer on ITO is possible without additional protection of ITO. The second part concentrates on a new seed-layer metallization ink based on decomposing metal organic salts. The ink contacts the emitter through the SiNx antireflection coating at 480 degree Celsius. The process of contact formation is investigated in detail. In-situ glass formation takes place and penetrates the antireflection coating. Silver dendrites contact the emitter. Glass composition is crucial for an effective reaction with SiNx. An advanced model for the contact formation by the ink is introduced.