Beschreibung
Inhaltsangabe* Introduction * Crystal Growth * Silicon Oxidation * Photolithography * Etching * Diffusion * Ion Implantation * Film Deposition * Process Integration * IC Manufacturing * Future Trends and Challenges Appendix A: List of Symbols Appendix B: International System of Units Appendix C: Unit Prefixes Appendix D: Greek Alphabet Appendix E: Physical Constants Appendix F: Properties of Si and GaAs at 300K Appendix G: Properties of the Error Function Appendix H: Basic Kinetic Theory of Gas Appendix I: SUPREM Commands Appendix J: Percentage Points of the t Distribution Appendix K: Percentage Points of the F Distribution
Autorenportrait
Inhaltsangabe* Introduction * Crystal Growth * Silicon Oxidation * Photolithography * Etching * Diffusion * Ion Implantation * Film Deposition * Process Integration * IC Manufacturing * Future Trends and Challenges Appendix A: List of Symbols Appendix B: International System of Units Appendix C: Unit Prefixes Appendix D: Greek Alphabet Appendix E: Physical Constants Appendix F: Properties of Si and GaAs at 300K Appendix G: Properties of the Error Function Appendix H: Basic Kinetic Theory of Gas Appendix I: SUPREM Commands Appendix J: Percentage Points of the t Distribution Appendix K: Percentage Points of the F Distribution
